Company Story
1993 - Meyer Burger Technology AG was founded by Fritz Meyer Burger in Switzerland
1995 - Development of the first wire saw for cutting silicon wafers
2000 - IPO and listing on the SIX Swiss Exchange
2003 - Expansion into Asia with the establishment of a subsidiary in Taiwan
2007 - Acquisition of Roth & Rau AG, a German company specializing in photovoltaic and semiconductor technology
2010 - Introduction of the first diamond wire saw for cutting silicon wafers
2012 - Establishment of a subsidiary in the United States
2015 - Acquisition of a majority stake in the German company, Oxford Photovoltaics Ltd.
2018 - Introduction of the SWCT (Smart Wire Cutting Technology) for high-efficiency solar cells