-2.19%
-9.27%
-7.42%
-15.93%
-25.50%
13.64%
115.49%
AI Spotlight on AMKR
Company Description
Amkor Technology, Inc.provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific.It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services.
The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications.In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure.Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives.
It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries.Amkor Technology, Inc.was founded in 1968 and is headquartered in Tempe, Arizona.
Market Data
| Last Price | 24.07 |
| Change Percentage | -2.19% |
| Open | 23.76 |
| Previous Close | 24.61 |
| Market Cap ( Millions) | 5936 |
| Volume | 384821 |
| Year High | 44.86 |
| Year Low | 23.33 |
| M A 50 | 25.96 |
| M A 200 | 30.94 |
Financial Ratios
| FCF Yield | 7.23% |
| Dividend Yield | 3.01% |
| ROE | 9.05% |
| Debt / Equity | 30.01% |
| Net Debt / EBIDTA | 26.62% |
| Price To Book | 1.42 |
| Price Earnings Ratio | 16.21 |
| Price To FCF | 13.83 |
| Price To sales | 0.92 |
| EV / EBITDA | 5.71 |
News
- Jan -31 - Amkor Technology (AMKR) Suffers a Larger Drop Than the General Market: Key Insights
- Jan -21 - Amkor Technology to Announce Fourth Quarter and Full Year 2024 Financial Results on February 10, 2025
- Jan -16 - Amkor Technology (AMKR) Ascends While Market Falls: Some Facts to Note
- Jan -11 - Amkor Technology (AMKR) Sees a More Significant Dip Than Broader Market: Some Facts to Know
- Jan -03 - Amkor Technology (AMKR) Advances While Market Declines: Some Information for Investors
- Dec -27 - Amkor Technology (AMKR) Falls More Steeply Than Broader Market: What Investors Need to Know
- Dec -26 - Amkor Technology (AMKR) Suffers a Larger Drop Than the General Market: Key Insights
- Dec -20 - Amkor Technology (AMKR) Advances But Underperforms Market: Key Facts
- Dec -20 - Amkor Technology (AMKR) Falls More Steeply Than Broader Market: What Investors Need to Know
- Dec -16 - Amkor Technology Names John Liu to Board of Directors
- Nov -20 - Amkor Stock Plunges 24% Year to Date: What Should Investors Do?
- Nov -14 - Lightmatter and Amkor Technology Partner to Build World's Largest 3D Photonics Package
- Nov -13 - Amkor Technology Declares Increase in Quarterly Dividend and Special Dividend
- Nov -01 - Bear Of The Day: Amkor Technology (AMKR)
- Oct -31 - New Strong Sell Stocks for October 31st
- Oct -29 - Amkor Q3 Earnings Miss: Will Dim Q4 Guidance Pull Down the Stock?
- Oct -29 - Amkor Technology's Q3 Earnings Pack Sales Growth But Margins Compress
- Oct -29 - Amkor Technology: Advanced Packaging And TSMC Partnership, Initiate With Buy
- Oct -29 - Amkor Technology, Inc. (AMKR) Q3 2024 Earnings Call Transcript
- Oct -28 - Amkor Technology (AMKR) Lags Q3 Earnings Estimates
Business Breakdown
Expected Mid-Term Growth
Segment n°1 -> Advanced Products
Expected Growth : 8 %
What the company do ?
Advanced Products from Amkor Technology, Inc. include cutting-edge semiconductor packaging solutions, such as System-in-Package (SiP), Wafer-Level Packaging, and 3D Stacked Memory, enabling high-performance and low-power applications.
Why we expect these perspectives ?
Amkor Technology's Advanced Products segment growth is driven by increasing demand for high-performance computing, artificial intelligence, and 5G-enabled devices. The company's leadership in 2.5D and 3D packaging, as well as its strong relationships with top-tier OEMs, position it for continued growth in this segment.
Segment n°2 -> Mainstream Products
Expected Growth : 6 %
What the company do ?
Amkor Technology, Inc.'s mainstream products include semiconductor packaging and test services, wafer-level chip scale packages, and flip chip and wire bond solutions.
Why we expect these perspectives ?
Amkor Technology's mainstream products, such as advanced semiconductor packaging and test services, drive 6% growth. Key drivers include increasing demand for 5G, IoT, and AI-enabled devices, as well as the adoption of autonomous vehicles and smart homes. Additionally, the growing need for miniaturization, higher performance, and reduced power consumption in electronic devices fuels growth.
Amkor Technology, Inc. Products
| Product Range | What is it ? |
|---|---|
| Wafer Bumping | A process of attaching tiny solder balls to the die of a semiconductor wafer, enabling flip chip assembly |
| Flip Chip Assembly | A method of attaching a die to a substrate using solder bumps, enabling high-speed and high-density interconnects |
| Wafer Level Packaging | A process of packaging semiconductor devices at the wafer level, enabling smaller form factors and improved performance |
| System-in-Package (SiP) | A packaging technology that integrates multiple dies and components into a single package, enabling smaller form factors and improved performance |
| Test and Burn-in Services | A service that tests and burns-in semiconductor devices to ensure reliability and performance |
| Wafer Processing | A service that provides wafer-level processing, including thinning, dicing, and sorting |
Amkor Technology, Inc.'s Porter Forces
Threat Of Substitutes
The threat of substitutes for Amkor Technology, Inc. is medium due to the availability of alternative semiconductor packaging and test services from other companies.
Bargaining Power Of Customers
The bargaining power of customers is high due to the concentration of major customers such as Qualcomm, Intel, and Texas Instruments, which gives them significant negotiating power.
Bargaining Power Of Suppliers
The bargaining power of suppliers is low due to the availability of multiple suppliers for raw materials and equipment, reducing their negotiating power.
Threat Of New Entrants
The threat of new entrants is low due to the high capital requirements and technological barriers to entry in the semiconductor packaging and test industry.
Intensity Of Rivalry
The intensity of rivalry is high due to the competitive nature of the semiconductor packaging and test industry, with multiple players competing for market share.
Capital Structure
| Value | |
|---|---|
| Debt Weight | 24.63% |
| Debt Cost | 5.22% |
| Equity Weight | 75.37% |
| Equity Cost | 13.69% |
| WACC | 11.61% |
| Leverage | 32.68% |
Amkor Technology, Inc. : Quality Control
Amkor Technology, Inc. passed 7 out of 9 key points:
Historical Valuation
Price/Earnings Ratio
Margin Valuation
Peers Valuation
Competitors
| Company | Rational |
|---|---|
| OLED | Universal Display Corporation engages in the research, development, and commercialization of organic light emitting diode (OLED) technologies and materials for use in display and solid-state lighting applications. It owns, exclusively … |
| VECO | Veeco Instruments Inc., together with its subsidiaries, develops, manufactures, sells, and supports semiconductor and thin film process equipment primarily to make electronic devices worldwide. The company offers laser annealing, ion … |
| FORM | FormFactor, Inc. designs, manufactures, and sells probe cards, analytical probes, probe stations, metrology systems, thermal systems, and cryogenic systems to semiconductor companies and scientific institutions. It operates in two segments, … |
| MTSI | MACOM Technology Solutions Holdings, Inc., together with its subsidiaries, designs and manufactures analog semiconductor solutions for use in wireless and wireline applications across the radio frequency (RF), microwave, millimeter wave, … |
| RMBS | Rambus Inc. provides semiconductor products in the United States, Taiwan, South Korea, Japan, Europe, Canada, Singapore, China, and internationally. The company offers DDR memory interface chips, including DDR5, DDR4 and … |
Peers Metrics
DCF BETA
Expected Cash-Flows
Scoring Insights
Peers Group Analysis
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Amkor Technology
A-Score
1-Year Total Return ->
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Universal Display
A-Score
1-Year Total Return ->
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MACOM Tech
A-Score
1-Year Total Return ->
4
Rambus
A-Score
1-Year Total Return ->
5
FormFactor
A-Score
1-Year Total Return ->
6
