1.46%
-5.74%
27.32%
4.66%
-10.80%
68.97%
224.66%

Company Description

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide.The company's principal products include die attach equipment, such as single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems.Its principal products also comprise plating equipment comprising tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services.


The company's principal brand names include Datacon, Esec, Fico, and Meco.It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies.The company was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

Market Data

Last Price 124.7
Change Percentage 1.46%
Open 123.85
Previous Close 122.9
Market Cap ( Millions) 9919
Volume 556422
Year High 182.9
Year Low 91.2
M A 50 130.11
M A 200 127.34

Financial Ratios

FCF Yield 1.60%
Dividend Yield 1.72%
ROE 39.43%
Debt / Equity 115.98%
Net Debt / EBIDTA 96.65%
Price To Book 21.34
Price Earnings Ratio 55.91
Price To FCF 62.65
Price To sales 16.16
EV / EBITDA 42.23

News

Business Breakdown

Expected Mid-Term Growth

Segment nΒ°1 -> Die Attach

Expected Growth : 8.32 %

What the company do ?

Die Attach from BE Semiconductor Industries N.V. is a process of attaching a semiconductor die to a lead frame or substrate using adhesives or eutectic bonds.

Why we expect these perspectives ?

The 8.32% growth in Die Attach from BE Semiconductor Industries N.V. is driven by increasing demand for semiconductor devices, particularly in the automotive and IoT sectors. Additionally, the trend towards miniaturization and higher performance in electronics is fueling growth. Furthermore, BE Semiconductor's strong market position, innovative products, and strategic partnerships are contributing to its growth momentum.

Segment nΒ°2 -> Packaging

Expected Growth : 8.78 %

What the company do ?

Packaging from BE Semiconductor Industries N.V. refers to the process of assembling, sorting, and preparing semiconductor devices for shipment, ensuring secure and reliable delivery.

Why we expect these perspectives ?

BE Semiconductor Industries N.V.'s packaging growth is driven by increasing demand for advanced packaging technologies, such as flip chip and wafer-level packaging, in high-growth markets like 5G, IoT, and automotive. Additionally, the company's strong relationships with leading semiconductor companies and its ability to provide customized packaging solutions contribute to its growth.

Segment nΒ°3 -> Plating

Expected Growth : 8.32 %

What the company do ?

Plating from BE Semiconductor Industries N.V. refers to the electrochemical process of depositing a thin layer of material, such as metal, onto a semiconductor wafer's surface to create electrical connections.

Why we expect these perspectives ?

BE Semiconductor Industries N.V.'s plating segment growth of 8.32% is driven by increasing demand for advanced packaging technologies, rising adoption of 5G and IoT devices, and growing need for miniaturization and connectivity in the semiconductor industry. Additionally, the company's strategic investments in R&D and capacity expansion have enabled it to capitalize on emerging trends and opportunities.

Be Semiconductor Industries N.V. Products

Product Range What is it ?
Die Products BE Semiconductor Industries N.V. offers a wide range of die products, including discrete semiconductor devices, integrated circuits, and optoelectronic devices.
Wafer Products The company provides wafer products, including silicon wafers, silicon-on-insulator (SOI) wafers, and epitaxial wafers.
Assembly and Test Services BE Semiconductor Industries N.V. offers assembly and test services for semiconductor devices, including wire bonding, flip chip, and wafer level packaging.
Module and Sub-Assembly Services The company provides module and sub-assembly services, including the assembly of semiconductor devices into modules and sub-assemblies.
Design and Manufacturing Services BE Semiconductor Industries N.V. offers design and manufacturing services, including design, development, and manufacturing of semiconductor devices.

BE Semiconductor Industries N.V.'s Porter Forces

The threat of substitutes for BE Semiconductor Industries N.V. is medium due to the presence of alternative semiconductor manufacturers, but the company's strong brand reputation and customer loyalty mitigate this threat.

The bargaining power of customers is low due to the company's strong relationships with its customers and the customized nature of its products, making it difficult for customers to switch suppliers.

The bargaining power of suppliers is medium due to the company's dependence on a few key suppliers, but the company's strong relationships with these suppliers and its ability to negotiate prices mitigate this threat.

The threat of new entrants is low due to the high barriers to entry in the semiconductor industry, including the need for significant capital investment and technological expertise.

The intensity of rivalry is high due to the competitive nature of the semiconductor industry, with many established players competing for market share.

Capital Structure

Value
Debt Weight 43.10%
Debt Cost 4.29%
Equity Weight 56.90%
Equity Cost 11.58%
WACC 8.43%
Leverage 75.74%

Historical Valuation

Price/Earnings Ratio

Margin Valuation

Peers Valuation

Competitors

Company Rational
TSEM Tower Semiconductor Ltd., an independent semiconductor foundry, manufactures and markets analog intensive mixed-signal semiconductor devices in the United States, Japan, other Asia countries, and Europe. It provides various customizable process …
AIXA.DE AIXTRON SE, together with its subsidiaries, provides deposition equipment to the semiconductor industry in Asia, Europe, and the Americas. It develops, produces, sells, maintains, and installs equipment for the deposition …
NVMI Nova Ltd. designs, develops, produces, and sells process control systems used in the manufacture of semiconductors in Israel, Taiwan, the United States, China, Korea, and internationally. Its product portfolio includes …
MELE.BR Melexis NV designs, develops, tests, and markets advanced integrated semiconductor devices primarily for the automotive industry in Europe, the Middle-East, Africa, the Asia Pacific, and North and Latin America. The …
CAMT Camtek Ltd., together with its subsidiaries, develops, manufactures, and sells inspection and metrology equipment for the advanced interconnect packaging, memory, complementary metal oxide semiconductor image sensors, micro-electro mechanical systems, radio …

Peers Metrics

DCF BETA

Parameters

Short Term Growth
Short term Time
Long-Term Growth
WACC
Target Price
124.7$
Current Price
124.7$
Potential
-0.00%

Expected Cash-Flows

Scoring Insights

Peers Group Analysis

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